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DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond | Adjustable 90-150C Clean-Release No-Residue Auto-Peel PET Film | Chip Inductor Sapphire LCD Cutting Automation | KHJ

DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond | Adjustable 90-150C Clean-Release No-Residue Auto-Peel PET Film | Chip Inductor Sapphire LCD Cutting Automation | KHJ

Markenname: KHJ
Modellnummer: DTS640A
Ausführliche Information
Herkunftsort:
China
Zertifizierung:
ROHS、ISO9001
Produkt-Beschreibung
1. Product Description DTS640A is a double-sided tape with good initial tack. One side features a foamed (thermally expandable) adhesive layer, while the other side is a conventional pressure-sensitive adhesive (PSA) layer. When heated at 150–160°C, the foamed adhesive layer gradually loses its tack and enables automatic detachment from the bonded substrate. 2. Product Structure 3. Product Features ✔ Initial heat resistance with no re-tack (no sticky residue after thermal